Light emitting device package

ABSTRACT

A light emitting device package includes a cell array including a plurality of semiconductor light emitting units, and having a first surface and a second surface opposite the first surface, each of the plurality of semiconductor light emitting units having a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer stacked on each other. The light emitting device package may further include a plurality of wavelength conversion units disposed on the first surface of the cell array to correspond to the plurality of semiconductor light emitting units, respectively, each configured to convert a wavelength of light, emitted by a respective one of the plurality of semiconductor light emitting units, into a different wavelength of light, and a partition structure disposed in a space between the plurality of wavelength conversion units, and a plurality of switching units spaced apart from the plurality of wavelength conversion units within the partition structure, and electrically connected to the plurality of semiconductor light emitting units.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims benefit of priority to Korean Patent ApplicationNo. 10-2016-0059941, filed on May 17, 2016 with the Korean IntellectualProperty Office, the disclosure of which is incorporated herein byreference in its entirety.

BACKGROUND

1. Field

The present inventive concept relates to alight emitting device package,a display apparatus using the same, and a method of manufacturing thelight emitting device package.

2. Description of Related Art

Semiconductor light emitting diodes (LEDs) have been used as lightsources in various electronic products, as well as light sources inlighting devices. In particular, semiconductor LEDs are widely used aslight sources for various types of display devices, such as televisions,mobile phones, personal computers (PCs), laptop PCs, and personaldigital assistants (PDAs).

Conventional display devices have included display panels, commonly,liquid crystal display (LCD) panels and backlight units; recently,however, display devices which do not require additional backlightunits, due to the use of an LED device as a single pixel therein, havebeen under development. Such display devices may be miniaturized, andmay be implemented as high luminance displays with improved opticalefficiency, as compared to conventional LCDs. Further, such displaydevices may allow an aspect ratio of a displayed image to be freelychanged, and may be implemented as large display devices, therebyfacilitating the development of a range of large display devices.

SUMMARY

An aspect of the present inventive concept may provide a light emittingdevice package not requiring a separate thin film transistor (TFT)substrate, a method of manufacturing the same, and a display apparatususing the light emitting device package.

According to an aspect of the present inventive concept, a lightemitting device package may include a cell array including a pluralityof semiconductor light emitting units, and having a first surface and asecond surface opposite the first surface, each of the plurality ofsemiconductor light emitting units having a first conductivesemiconductor layer, an active layer, and a second conductivesemiconductor layer stacked on each other. The light emitting devicepackage may further include a plurality of wavelength conversion unitsdisposed on the first surface of the cell array to correspond to theplurality of semiconductor light emitting units, respectively, eachconfigured to convert a wavelength of light, emitted by a respective oneof the plurality of semiconductor light emitting units, into a differentwavelength of light. The light emitting device package may furtherinclude a partition structure disposed in a space between the pluralityof wavelength conversion units so as to separate the plurality ofwavelength conversion units from each other, and a plurality ofswitching units spaced apart from the plurality of wavelength conversionunits within the partition structure, and electrically connected to theplurality of semiconductor light emitting units so as to selectivelydrive the plurality of semiconductor light emitting units.

According to an aspect of the present inventive concept, a lightemitting device package may include: a substrate for growth having afirst plane and a second plane opposing the first plane, a plurality ofsemiconductor light emitting units disposed on the first plane of thesubstrate for growth to be spaced apart from each other, and each havinga first conductive semiconductor layer, an active layer, and a secondconductive semiconductor layer, a plurality of wavelength conversionunits contacting the plurality of semiconductor light emitting units,respectively, and spaced apart from each other to have a portion of thesubstrate for growth therebetween, each configured to convert awavelength of light, emitted by a respective one of the plurality ofsemiconductor light emitting units, into a different wavelength oflight, and a plurality of switching units disposed in the substrate forgrowth on the first plane of the substrate for growth to be spaced apartfrom the plurality of semiconductor light emitting units, andelectrically connected to the plurality of semiconductor light emittingunits so as to selectively drive the plurality of semiconductor lightemitting units.

According to an aspect of the present inventive concept, a displayapparatus may include: a display panel having a circuit board and aplurality of light emitting device packages disposed on the circuitboard to form rows and columns, a panel driving unit driving the displaypanel, and a control unit controlling the panel driving unit, in whicheach of the plurality of light emitting device packages may include: acell array including a plurality of semiconductor light emitting units,and having a first plane and a second plane opposing the first plane,each of the plurality of semiconductor light emitting units having afirst conductive semiconductor layer, an active layer, and a secondconductive semiconductor layer, a plurality of wavelength conversionunits disposed on the first plane of the cell array to correspond to theplurality of semiconductor light emitting units, respectively, andconfigured to convert a wavelength of light, emitted by the plurality ofsemiconductor light emitting units, into a different wavelength oflight, a partition structure disposed in a space between the pluralityof wavelength conversion units so as to separate the plurality ofwavelength conversion units from each other, and a plurality ofswitching units spaced apart from the plurality of wavelength conversionunits within the partition structure, respectively, and electricallyconnected to the plurality of semiconductor light emitting units so asto selectively drive the plurality of semiconductor light emittingunits.

According to an aspect of the present inventive concept, a method ofmanufacturing a light emitting device package may include: providing aplurality of light emitting diode (LED) chips spaced apart from eachother by stacking a first conductive semiconductor layer, an activelayer, and a second conductive semiconductor layer on a substrate forgrowth, and etching the substrate for growth to be exposed, forming aninsulating layer to cover the plurality of LED chips and an exposedregion of the substrate for growth, forming a plurality of switchingdevices by doping, with impurities, portions of the exposed region ofthe substrate for growth, each of the plurality of switching devicesincluding a source region and a drain region, forming a plurality ofthrough holes, by which the plurality of LED chips are exposed,respectively, by etching portions of a region of the substrate forgrowth contacting the plurality of LED chips, and forming a plurality ofwavelength conversion units by filling the plurality of through holeswith wavelength conversion materials.

According to an aspect of the present inventive concept, a lightemitting device package includes a cell array, including a plurality ofsemiconductor light emitting units, each semiconductor light emittingunit having a first surface at a first vertical height and a secondsurface opposite the first surface at a second vertical height, and eachsemiconductor light emitting unit including a first conductivesemiconductor layer, an active layer, and a second conductivesemiconductor layer stacked on each other; a plurality of wavelengthconversion units disposed respectively on the plurality of semiconductorlight emitting units, each wavelength conversion unit having a firstsurface at the first vertical height and a second surface at a thirdvertical height, wherein the first vertical height is between the secondvertical height and the third vertical height, each wavelengthconversion unit configured to convert a wavelength of light, emitted bya respective one of the plurality of semiconductor light emitting units,into a different wavelength of light; a partition structure disposed ina space between the plurality of wavelength conversion units so as toseparate the plurality of wavelength conversion units from each other,the partition structure extending between the first vertical height andthe third vertical height; and a plurality of switching units spacedapart from the plurality of wavelength conversion units within thepartition structure, and electrically connected to the plurality ofsemiconductor light emitting units so as to selectively drive theplurality of semiconductor light emitting units, each switching unitdisposed between the first vertical height and the third verticalheight.

BRIEF DESCRIPTION OF DRAWINGS

The above and other aspects, features, and advantages of the presentdisclosure will be more clearly understood from the following detaileddescription taken in conjunction with the accompanying drawings, inwhich:

FIG. 1 is a schematic perspective view of a display panel includingalight emitting device package according to an example embodiment of thepresent inventive concept;

FIG. 2 is an example enlarged plan view of region A of FIG. 1;

FIG. 3 is an example enlarged plan view of a portion of FIG. 2;

FIG. 4 is an example enlarged rear view of the portion of FIG. 2;

FIG. 5 is an example cross-sectional view taken along line I-I′ of FIG.3;

FIG. 6 is an example cross-sectional view taken along line II-II′ ofFIG. 3;

FIG. 7 is an example enlarged cross-sectional view of region B of FIG.6;

FIGS. 8 through 10 are plan views of light emitting device packageshaving various structures employable according to an example embodimentof the present inventive concept;

FIG. 11 is an example circuit diagram of a light emitting devicepackage;

FIG. 12 is an example circuit diagram of a light emitting device packagehaving another structure employable according to an example embodimentof the present inventive concept;

FIGS. 13A, 13B, 14A, 14B, 15A, 15B, 16A, 16B, 17A, 17B, 18A, 18B, 19A,19B, 20A, 20B, 21A, 21B, 22A, 22B, 23A, 23B, 24A, 24B, 25A, and 25B areexample schematic cross-sectional views of a process of manufacturing alight emitting device package;

FIG. 26 is a CIE 1931 color space chromaticity diagram illustrating awavelength conversion material employable in a light source moduleaccording to an example embodiment of the present inventive concept; and

FIG. 27 is a view of an indoor smart network system in which a displaypanel according to an example embodiment of the present inventiveconcept may be employed.

DETAILED DESCRIPTION

Although the figures described herein may be referred to using languagesuch as “one embodiment,” or “certain embodiments,” these figures, andtheir corresponding descriptions are not intended to be mutuallyexclusive from other figures or descriptions, unless the context soindicates. Therefore, certain aspects from certain figures may be thesame as certain features in other figures, and/or certain figures may bedifferent representations or different portions of a particularexemplary embodiment.

It will be understood that, although the terms first, second, third etc.may be used herein to describe various elements, components, regions,layers and/or sections, these elements, components, regions, layersand/or sections should not be limited by these terms. Unless the contextindicates otherwise, these terms are only used to distinguish oneelement, component, region, layer or section from another element,component, region, layer or section, for example as a naming convention.Thus, a first element, component, region, layer or section discussedbelow in one section of the specification could be termed a secondelement, component, region, layer or section in another section of thespecification or in the claims without departing from the teachings ofthe present invention. In addition, in certain cases, even if a term isnot described using “first,” “second,” etc., in the specification, itmay still be referred to as “first” or “second” in a claim in order todistinguish different claimed elements from each other.

It will be understood that when an element is referred to as being“connected” or “coupled” to or “on” another element, it can be directlyconnected or coupled to or on the other element or intervening elementsmay be present. In contrast, when an element is referred to as being“directly connected” or “directly coupled” to another element, or as“contacting” or “in contact with” another element, there are nointervening elements present. Other words used to describe therelationship between elements should be interpreted in a like fashion(e.g., “between” versus “directly between,” “adjacent” versus “directlyadjacent,” etc.).

Embodiments described herein will be described referring to plan viewsand/or cross-sectional views by way of ideal schematic views.Accordingly, the exemplary views may be modified depending onmanufacturing technologies and/or tolerances. Therefore, the disclosedembodiments are not limited to those shown in the views, but includemodifications in configuration formed on the basis of manufacturingprocesses. Therefore, regions exemplified in figures may have schematicproperties, and shapes of regions shown in figures may exemplifyspecific shapes of regions of elements to which aspects of the inventionare not limited.

Terms such as “same,” “equal,” “planar,” or “coplanar,” as used hereinwhen referring to orientation, layout, location, shapes, sizes, amounts,or other measures do not necessarily mean an exactly identicalorientation, layout, location, shape, size, amount, or other measure,but are intended to encompass nearly identical orientation, layout,location, shapes, sizes, amounts, or other measures within acceptablevariations that may occur, for example, due to manufacturing processes.The term “substantially” may be used herein to emphasize this meaning,unless the context or other statements indicate otherwise. For example,items described as “substantially the same,” “substantially equal,” or“substantially planar,” may be exactly the same, equal, or planar, ormay be the same, equal, or planar within acceptable variations that mayoccur, for example, due to manufacturing processes.

FIG. 1 is a schematic perspective view of a display panel including alight emitting device package according to an example embodiment of thepresent inventive concept.

Referring to FIG. 1, a display panel 1 may include a circuit board 20and a light emitting device module 10 disposed on the circuit board 20.

According to an example embodiment, the light emitting device module 10may include a plurality of light emitting device packages 100 that mayselectively emit red, green, or blue (RGB) light. Each of the pluralityof light emitting device packages 100 may form a single pixel of thedisplay panel 1, and may be disposed on the circuit board 20 to formrows and columns. In an example embodiment, the light emitting devicepackages 100 may be exemplified as being arranged in a 15×15 matrix, butthis is only for ease of description. For example, a larger number oflight emitting device packages may be provided, depending on a requiredresolution (for example, a resolution of 1,024×768).

Each of the light emitting device packages 100 may include sub-pixelscorresponding to RGB light sources, and the sub-pixels may have astructure in which they are spaced apart from each other. This will bedescribed in more detail with reference to FIGS. 3 through 6. A color ofeach of the sub-pixels is not limited to RGB, and a cyan, yellow,magenta, or black (CYMK) light source may also be used.

The circuit board 20 may include a circuit configured to supply power toeach of the light emitting device packages 100 of the light emittingdevice module 10, and a circuit configured to drive the light emittingdevice packages 100. For example, the circuit board 20 may include apower supply circuit (PSC) and a driving circuit (DC).

If necessary, the display panel 1 may further include a black matrixdisposed on the circuit board 20. For example, the black matrix may bedisposed around the circuit board 20 to function as a guide linedefining a mounting region of the light emitting device packages 100.The black matrix is not limited to black. A white or green matrix may beused rather than the black matrix, depending on the purposes or uses ofproducts, and a matrix formed of a transparent material may also beused, if necessary. The white matrix may further include a reflectivematerial or a light scattering material. The black matrix may include atleast one among materials, such as a polymer containing a resin, aceramic, a semiconductor, or a metal.

FIG. 2 is an enlarged plan view of the display panel 1, illustrated inFIG. 1, and in particular, of region A of the light emitting devicemodule 10. FIG. 3 is an enlarged plan view of a portion of FIG. 2. FIG.4 is an enlarged rear view of the portion of FIG. 2.

Referring to FIG. 2, the plurality of light emitting device packages 100may be surrounded by a molding unit 51. The molding unit 51 may alsoinclude a black matrix, and regions of the light emitting devicepackages 100 surrounded by the molding unit 51 may be provided as lightemitting regions in which the light emitting device packages 100 may bedisposed, respectively, while an external region 52 of the molding unit51 may be provided as a non-light emitting region. The molding unit 51may electrically separate the light emitting device packages 100 fromeach other, and each of the light emitting device packages 100 may thusbe independently driven as a single pixel.

Referring to FIG. 3, each of the light emitting device packages 100forming a single pixel may include a first sub-pixel SP1, a secondsub-pixel SP2, and a third sub-pixel SP3, and the first to thirdsub-pixels SP1 to SP3 may be surrounded by a partition structure 110.The partition structure 110 may have three switching units SW1, SW2, andSW3 for controlling the first to third sub-pixels SP1 to SP3. In anexample embodiment, a single light emitting device package 100 may beexemplified as having three sub-pixels and three switching units, butthis is only for ease of description, and the single light emittingdevice package 100 may have two sub-pixels and two switching unitsdisposed therein. Further, respective switching units may be exemplifiedas being spaced apart from each other, but a plurality of switchingunits may also be disposed to have the appearance of a single switchingunit by the switching units being in contact with each other.

Referring to FIG. 4, each of the light emitting device packages 100 mayhave two common electrode pads CP1 and CP2 and three separate electrodepads AP1, AP2, and AP3, provided on a lower surface thereof. In anexample embodiment, the two common electrode pads CP1 and CP2 and a rowof the three separate electrode pads AP1, AP2, and AP3 may beexemplified as being arranged parallel to each other in a singledirection, but the present inventive concept is not limited thereto.

FIG. 5 is a cross-sectional view taken along line I-I′ of FIG. 3. FIG. 6is a cross-sectional view taken along line II-II′ of FIG. 3. FIG. 7 isan enlarged cross-sectional view of region B of FIG. 6.

Referring to FIGS. 5 through 7, the light emitting device package 100according to an example embodiment may include a cell array CA,including a first semiconductor light emitting unit LED1, a secondsemiconductor light emitting unit LED2, and a third semiconductor lightemitting unit LED3, a first wavelength conversion unit 171, a secondwavelength conversion unit 172, and a third wavelength conversion unit173, disposed on the cell array CA, the partition structure 110 havingthe first to third wavelength conversion units 171 to 173 spaced apartfrom each other, and the first to third switching units SW1 to SW3disposed in the partition structure 110.

The cell array CA may include the first to third semiconductor lightemitting units LED1 to LED3, and may have a first plane PL1 (e.g., at afirst vertical height) and a second plane PL2 (e.g., at a secondvertical height) opposing each other (e.g., first and second surfacesfacing opposite directions). The first plane PL1 may have the first tothird semiconductor light emitting units LED1 to LED3 disposed thereonto be adjacent to each other, and the first to third wavelengthconversion units 171 to 173 may thus contact the first to thirdsemiconductor light emitting units LED1 to LED3, respectively. Eachindividual one of the first to third semiconductor light emitting unitsLED1 to LED3 may also be referred to as semiconductor light emittingsource.

The first to third semiconductor light emitting units LED1 to LED3 mayemit light having the same or different colors. For example, the firstto third semiconductor light emitting units LED1 to LED3 may all emitthe same blue light (for example, light having a wavelength of 440 nm to460 nm) or the same ultraviolet light (for example, light having awavelength of 380 nm to 440 nm), and may also emit RGB light,respectively. An example embodiment describes a case in which the firstto third semiconductor light emitting units LED1 to LED3 emit blue lightas an example.

Each of the first to third semiconductor light emitting units LED1 toLED3 may have a light emitting structure 121 that may include a firstconductive semiconductor layer 121 a, a second conductive semiconductorlayer 121 c, and an active layer 121 b disposed in a space therebetween.

The first conductive semiconductor layer 121 a and the second conductivesemiconductor layer 121 c may be a p-type semiconductor layer and ann-type semiconductor layer, respectively. For example, each of the firstand second conductive semiconductor layers 121 a and 121 c may be anitride semiconductor having a composition of Al_(x)In_(y)Ga_((1-x-y))N(0≦x≦1, 0≦y≦1, 0≦x+y≦1), but the present inventive concept is notlimited thereto, and a GaAs- or GaP-based semiconductor may also beused. The active layer 121 b may have a multiple quantum well (MQW)structure in which quantum well layers and quantum barrier layers arealternately stacked with each other. For example, the active layer 121 bmay have a nitride-based MQW, such as InGaN/GaN or GaN/AlGaN, but thepresent inventive concept is not limited thereto, and the active layer121 b may be another semiconductor, such as GaAs/AlGaAs, InGaP/GaP, orGaP/AlGaP.

The active layer 121 b of each of the first to third semiconductor lightemitting units LED1 to LED3 may be configured to emit light havingdifferent wavelengths. This emitted light may be realized in variousways. In an example embodiment, the active layer 121 b of each of thefirst to third semiconductor light emitting units LED1 to LED3 may beconfigured to emit light having different colors, and may also beconfigured to emit light having the same color. For example, the activelayers 121 b may emit red, green and blue light, respectively, or mayemit the same blue light or the same ultraviolet light.

The first and second conductive semiconductor layers 121 a and 121 c maybe electrically connected to first and second electrodes 128 and 129,respectively. The first and second electrodes 128 and 129 may bedisposed in a mesa-etched region 122 of the first conductivesemiconductor layer 121 a and on the second conductive semiconductorlayer 121 c, respectively. For example, the first electrode 128 mayinclude at least one of aluminum (Al), gold (Au), chromium (Cr), nickel(Ni), titanium (Ti), or tin (Sn), and the second electrode 129 may beformed of a reflective metal. For example, the second electrode 129 mayinclude a material, such as silver (Ag), nickel (Ni), aluminum (Al),chromium (Cr), rhodium (Rh), palladium (Pd), iridium (Ir), ruthenium(Ru), magnesium (Mg), zinc (Zn), platinum (Pt), or gold (Au), and may beemployed as a structure having a single layer or two or more layers.

An insulating layer 124 may be disposed on surfaces of the first tothird semiconductor light emitting units LED1 to LED3 and on the firstplane PL1 of the cell array CA to define regions in which the first andsecond electrodes 128 and 129 of each of the first to thirdsemiconductor light emitting units LED1 to LED3 may be disposed.Further, the insulating layer 124 disposed on the first plane PL1 of thecell array CA may define regions in which a source electrode 136 and adrain electrode 134 of each of the first to third switching units SW1 toSW3 may be disposed. As illustrated in FIG. 7, an insulating layer 124a, disposed in a space between the source electrode 136 and the drainelectrode 134, may be used as a gate insulating layer of each of thefirst to third switching units SW1 to SW3.

As illustrated in FIG. 6, the cell array CA may include a molding unit140 that may form the second plane PL2 of the cell array CA whilepackaging the first to third semiconductor light emitting units LED1 toLED3. The molding unit 140 may be configured to expose a firstconductive via 141, a second conductive via 142, and a third conductivevia 143, connected to the first to third semiconductor light emittingunits LED1 to LED3 and the first to third switching units SW1 to SW3,respectively, to the second plane PL2. The molding unit 140 may have ahigh level of Young's Modulus to stably support the first to thirdsemiconductor light emitting units LED1 to LED3. Further, the moldingunit 140 may include a material having a high level of thermalconductivity to effectively dissipate heat generated by the first tothird semiconductor light emitting units LED1 to LED3. For example, themolding unit 140 may include a material containing an epoxy resin or asilicone resin, and may also include light-reflective particles forreflecting light. The light-reflective particles may include a titaniumdioxide (TiO2) and/or an aluminum oxide (Al3O3), but the presentinventive concept is not limited thereto.

The cell array CA may have a multilayer circuit board 151 disposed onthe second plane PL2 thereof to connect the first to third conductivevias 141 to 143 to the common electrode pads CP1 and CP2 and to theseparate electrode pads AP1, AP2, and AP3. The multilayer circuit board151 may include a plurality of printed circuit boards (PCBs) 151 a and151 b that may be stacked, and the PCBs 151 a and 151 b may include athrough electrode 154 and a wiring 156. The multilayer circuit board 151may have the common electrode pads CP1 and CP2 and the separateelectrode pads AP1, AP2, and AP3 disposed on a surface thereof.

The cell array CA may have the partition structure 110 disposed on thefirst plane PL1 thereof, the first to third wavelength conversion units171 to 173 may be separated from each other in the partition structure110, and the partition structure 110 may have the first to thirdswitching units SW1 to SW3 disposed therein. The partition structure aswell as the first to third wavelength conversion units 171 to 173 mayextend between the first plane PL1 and a third plane PL3 at a thirdvertical height. As such, the partition structure and the first to thirdwavelength conversion units 171 to 173 may have a first surface at thefirst vertical height (e.g., the first plane PL1) and a second surfaceat the third vertical height (e.g., the third plane PL3).

The partition structure 110 may contact the first plane PL1 of the cellarray CA, and may have a first light emitting window 111, a second lightemitting window 112, and a third light emitting window 113 disposed inpositions corresponding to those of the first to third semiconductorlight emitting units LED1 to LED3. The first to third light emittingwindows 111 to 113 may be provided as spaces for forming the first tothird wavelength conversion units 171 to 173, respectively. Thepartition structure 110 may include a light blocking material such thatdifferent wavelengths of light penetrating through the first to thirdwavelength conversion units 171 to 173 may not interfere with eachother. Further, the partition structure 110 may be formed of a substratefor growth for growing the first to third semiconductor light emittingunits LED1 to LED3. The partition structure 110 may be a semiconductorsubstrate in which the first to third switching units SW1 to SW3 may beformed by injecting impurities. For example, the partition structure 110may be a group IV semiconductor substrate or a group III-IV compoundsemiconductor substrate, such as a silicon (Si) substrate, an SiCsubstrate, or an SiGe substrate.

The partition structure 110 may separate the first to third wavelengthconversion units 171 to 173 from each other, and may surround lateralsurfaces of the first to third wavelength conversion units 171 to 173.The partition structure 110 may contact the molding unit 140. As such,the partition structure 110 and the molding unit 140 may extend from aspace between the first to third wavelength conversion units 171 to 173to a space between the first to third semiconductor light emitting unitsLED1 to LED3 to thus effectively block the interference between lightemitted by the first to third semiconductor light emitting units LED1 toLED3.

The first to third wavelength conversion units 171 to 173 may adjustwavelengths of light, emitted by the first to third semiconductor lightemitting units LED1 to LED3, into wavelengths of light corresponding todifferent colors. In an example embodiment, the first to thirdwavelength conversion units 171 to 173 may be configured to provideblue, green, and red light, respectively. The wavelength conversionunits described herein are also referred to as wavelength conversionpillars (e.g., first, second, third, etc., pillars), or wavelengthconversion layers (e.g., first, second, third, etc., layers).

As illustrated in an example embodiment, when the first to thirdsemiconductor light emitting units LED1 to LED3 emit blue light, thesecond and third wavelength conversion units 172 and 173 may includegreen and red phosphors P2 and P3, respectively. The second and thirdwavelength conversion units 172 and 173 may be formed by dispensing, inthe second and third light emitting windows 112 and 113,light-transmitting liquid resins in which a wavelength conversionmaterial, such as the green or red phosphor P2 or P3, may not be mixed,but may be formed using various different processes. For example, thesecond and third wavelength conversion units 172 and 173 may be providedas wavelength conversion films.

If necessary, the second and third wavelength conversion units 172 and173 may further include a light filtering layer 180 that may selectivelyblock blue light. Use of the light filtering layer 180 may allow thesecond and third light emitting windows 112 and 113 to emit only desiredgreen and red light, respectively.

As illustrated in an example embodiment, when the first to thirdsemiconductor light emitting units LED1 to LED3 emit blue light, thefirst wavelength conversion unit 171 may not include a phosphor. Thus,the first wavelength conversion unit 171 may provide the same blue lightas that emitted by the first semiconductor light emitting unit LED1.

The first wavelength conversion unit 171 may be formed by dispensing alight-transmitting liquid resin in which a phosphor is not mixed, butaccording to an example embodiment, may include a blue or blue-greenphosphor (for example, wavelength: 480 nm to 520 nm) for adjusting colorcoordinates of blue light. Such a phosphor may be employed to adjust thecolor coordinates of blue light that may be provided by the firstwavelength conversion unit 171, and may be mixed in an amount less thanthat of a phosphor mixed in the second and third wavelength conversionunits 172 and 173.

As illustrated in FIGS. 5 and 6, the first to third wavelengthconversion units 171 to 173 may have an encapsulation unit 190 disposedon surfaces thereon to prevent degradation of a phosphor.

The partition structure 110 may have the first to third switching unitsSW1 to SW3 disposed therein to control the first to third semiconductorlight emitting units LED1 to LED3 to be selectively driven.

Referring to FIGS. 3 and 6, the first to third switching units SW1 toSW3 may be disposed in regions adjacent to those of the first to thirdsemiconductor light emitting units LED1 to LED3, respectively. The firstto third semiconductor light emitting units LED1 to LED3 may be disposedin a row that is parallel with respect to the first plane PL1. The firstto third switching units SW1 to SW3 may be disposed in certain positionswithin the partition structure 110 in various ways.

FIGS. 8 through 10 are plan views of light emitting device packageshaving various structures employable according to an example embodimentof the present inventive concept, and example embodiments in whichpositions of the first to third switching units SW1 to SW3 according toan example embodiment described above are changed.

A light emitting device package 200 of FIG. 8 may differ from the lightemitting device packages 100 of FIG. 3, in that a partition structure210 may have two sub-pixels and two switching units disposed therein, ascompared to the light emitting device package 100 of FIG. 3. Otherconfigurations may be the same as that described in FIG. 3. When thelight emitting device package 200 is disposed in such a configuration,the light emitting device package 200 may be beneficial to have a firstsub-pixel SP1 a and a second sub-pixel SP2 a disposed therein in orderto allow for larger light emitting device packages to be formed.

A light emitting device package 300 of FIG. 9 may differ from the lightemitting device packages 100 of FIG. 3, in that each of a firstswitching unit SW1 b, a second switching unit SW2 b, and a thirdswitching unit SW3 b may have a region ER of a partition structure 310protruding internally from each of a first sub-pixel SP1 b, a secondsub-pixel SP2 b, and a third sub-pixel SP3 b, as compared to the firstto third switching units SW1 to SW3 of FIG. 3. Other configurations maybe the same as that described in FIG. 3. When the light emitting devicepackage 300 is disposed in such a configuration, a thickness between thefirst to third sub-pixels SP1 b to SP3 b may be further reduced, andsizes of the first to third sub-pixels SP1 b to SP3 b may be furtherincreased.

A light emitting device package 400 of FIG. 10 may differ from the lightemitting device package 300 of FIG. 3, in that four sub-pixels and fourswitching units may be disposed, a first switching unit SW1 c, a secondswitching unit SW2 c, a third switching unit SW3 c, and a fourthswitching unit SW4 c may be disposed in a central region CR of apartition structure 410, or a first sub-pixel SP1 c, a second sub-pixelSP2 c, a third sub-pixel SP3 c, and a fourth sub-pixel SP4 c may bedisposed around the central region CR. Other configurations may be thesame as that described in FIG. 3. When the number of sub-pixels isincreased, the light emitting device package 400 may be beneficial inincreasing a band of light emitted by disposing a sub-pixel for emittinglight (for example, white light) other than RGB light.

The first to third switching units SW1 to SW3 may be electricallyconnected to the first to third semiconductor light emitting units LED1to LED3, respectively, to control the first to third semiconductor lightemitting units LED1 to LED3. Each of the first to third switching unitsSW1 to SW3 may be a switching device, for example, a metal oxide siliconfield effect transistor (MOSFET). In an example embodiment, each of thefirst to third switching units SW1 to SW3 may be an N-channel MOSFET.

The first to third switching units SW1 to SW3 may have the samestructure. Referring to FIGS. 6 and 7, to prevent repetition of the samedescription here, only the third switching unit SW3 is described, butthe first and second switching units SW1 and SW2 may have the samestructure as SW3.

The third switching unit SW3 may have a p-well region 131, formed byinjecting a p-type impurity into the inside of an n-well that may beformed by injecting an n-type impurity, while a source region 133 b anda drain region 133 a, formed by injecting an n-type impurity, may alsobe disposed in a region of the p-well region 131. When power is appliedto the third switching unit SW3, a gate insulating layer 124 a may bedisposed in a space between the drain region 133 a and the source region133 b, in which an n-type channel may be formed. The source electrode136 and the drain electrode 134 may be connected to the source region133 b and the drain region 133 a, respectively, and a gate electrode 135may be disposed on the gate insulating layer 124 a. The third switchingunit SW3 may be spaced apart from a wavelength conversion unit adjacentthereto in order not to contact the wavelength conversion unit, and maybe smaller than the partition structure 110.

A connecting electrode 137 may be disposed in a space between the sourceelectrode 136 and the second electrode 129 of the third semiconductorlight emitting unit LED3, to electrically connect the third switchingunit SW3 to the third semiconductor light emitting unit LED3.

Referring to FIGS. 7 and 11, a circuit configuration of the first tothird switching units SW1 to SW3 and the first to third semiconductorlight emitting units LED1 to LED3 will be described. FIG. 11 is acircuit diagram of the light emitting device package 100. The drainelectrode 134 of each of the first to third switching units SW1 to SW3may be connected to the common electrode pad CP2 to receive power from aPSC, and the source electrode 136 of each of the first to thirdswitching units SW1 to SW3 may be connected to each of the first tothird switching units SW1 to SW3. Further, the gate electrode 135 ofeach of the first to third switching units SW1 to SW3 may be connectedto each of the separate electrode pads AP1, AP2, and AP3. Thus, acontrol signal of the driving circuit DC, which is connected to theseparate electrode pads AP1, AP2, and AP3, may allow the gate electrode135 of each of the first to third switching units SW1 to SW3 to beturned on/off, and, accordingly, power applied to the first to thirdsemiconductor light emitting units LED1 to LED3 may be controlled.

FIG. 12 is a circuit diagram of the light emitting device package 500having another structure employable according to an example embodimentof the present inventive concept, and as compared to the above-mentionedcircuit configuration, a circuit configuration of the light emittingdevice package 500 may differ from the above-mentioned circuitconfiguration, in that first to third semiconductor light emitting unitsLED1 to LED3 may be connected to drain electrodes of first to thirdswitching units SW1 to SW3, respectively.

The light emitting device package 100 having such a configuration as inFIG. 11 or 12 may have a switching unit formed within a partitionstructure, including a wavelength conversion unit to control asemiconductor light emitting unit, thus controlling the semiconductorlight emitting unit for outputting an image signal to be turned on/offwithout a separate thin film transistor (TFT) substrate. Thus, ascompared to a case in which a separate TFT substrate is required,manufacturing costs may be reduced, and an ultra thin display panelhaving a further reduced thickness may be provided.

According to an example embodiment, there may be provided a displayapparatus, including a display panel having a circuit board and aplurality of light emitting device packages disposed on the circuitboard to form rows and columns; a panel driving unit driving the displaypanel; and a control unit controlling the panel driving unit. Each ofthe light emitting device packages may include a cell array includingfirst to third semiconductor light emitting units, each having a firstconductive semiconductor layer, an active layer, and a second conductivesemiconductor layer, and having a first plane and a second planeopposing the first plane; first to third wavelength conversion unitsdisposed on the first plane of the cell array to correspond to the firstto third semiconductor light emitting units, respectively, andconfigured to convert a wavelength of light, emitted by the first tothird semiconductor light emitting units, into a different wavelength oflight to provide RGB light, respectively; a partition structure disposedin a space between the first to third wavelength conversion units so asto separate the first to third wavelength conversion units from eachother; and first to third switching units spaced apart from the first tothird wavelength conversion units within the partition structure,respectively, which are electrically connected to the first to thirdsemiconductor light emitting units so as to selectively drive the firstto third semiconductor light emitting units.

Also, according to these example embodiments, a light emitting devicepackage includes a cell array, including a plurality of semiconductorlight emitting units, each semiconductor light emitting unit having afirst surface at a first vertical height (e.g., PL1) and a secondsurface opposite the first surface at a second vertical height (e.g., asurface at the bottom of electrode 129), and each semiconductor lightemitting unit including a first conductive semiconductor layer, anactive layer, and a second conductive semiconductor layer stacked oneach other. The light emitting device package further includes aplurality of wavelength conversion units disposed respectively on theplurality of semiconductor light emitting units, each wavelengthconversion unit having a first surface at the first vertical height anda second surface at a third vertical height (e.g., PL3), wherein thefirst vertical height is between the second vertical height and thethird vertical height, each wavelength conversion unit configured toconvert a wavelength of light, emitted by a respective one of theplurality of semiconductor light emitting units, into a differentwavelength of light. The light emitting device package further includesa partition structure disposed in a space between the plurality ofwavelength conversion units so as to separate the plurality ofwavelength conversion units from each other, the partition structureextending between the first vertical height and the third verticalheight (e.g., it can have one surface at the first vertical height andan opposite surface at the third vertical height), and a plurality ofswitching units spaced apart from the plurality of wavelength conversionunits within the partition structure, and electrically connected to theplurality of semiconductor light emitting units so as to selectivelydrive the plurality of semiconductor light emitting units, eachswitching unit disposed between the first vertical height and the thirdvertical height (e.g., each switching unit can extend from the firstvertical height toward the third vertical height).

Next, a method of manufacturing a light emitting device packageaccording to an example embodiment of the present inventive concept willbe described.

FIGS. 13A, 13B, 14A, 14B, 15A, 15B, 16A, 16B, 17A, 17B, 18A, 18B, 19A,19B, 20A, 20B, 21A, 21B, 22A, 22B, 23A, 23B, 24A, 24B, 25A, and 25B areschematic cross-sectional views of a process of manufacturing a lightemitting device package. In more detail, the method of manufacturing alight emitting device package relates to a method of manufacturing awafer-level chip scale package. Discussion of the above-mentionedprocess drawings, which illustrate enlarged cross sections of a portionof a light emitting device package, will help facilitate understandingof the current application.

Referring to FIGS. 13A and 13B, the method of manufacturing a lightemitting device package may start from forming, on a substrate forgrowth 110 a, a light emitting structure 121 that may include a firstconductive semiconductor layer 121 a, an active layer 121 b, and asecond conductive semiconductor layer 121 c.

The substrate for growth 110 a may be an insulating, conductive, orsemiconductor substrate, if necessary. The substrate for growth 110 amay have the light emitting structure 121 formed on a surface thereof,and may be a semiconductor substrate on which a MOSFET may be formed bydoping a region of the semiconductor substrate with an impurity. Forexample, the substrate for growth 110 a may be a group IV semiconductorsubstrate or a group III-IV compound semiconductor substrate, such as asilicon (Si) substrate, an SiC substrate, or an SiGe substrate. Thelight emitting structure 121 may be an epitaxial layer of a group IIInitride-based semiconductor layer formed on the substrate for growth 110a to form a plurality of light emitting regions. The first conductivesemiconductor layer 121 a may be, for example, a nitride semiconductorlayer satisfying a composition of n-type In_(x)Al_(y)Ga_(1-x-y)N (0≦x<1,0≦y<1, 0≦x+y<1), and an n-type impurity may be silicon (Si), germanium(Ge), selenium (Se), or tellurium (Te). The active layer 121 b may have,for example, an MQW structure, in which quantum well layers and quantumbarrier layers are alternately stacked with each other. For example, thequantum well layers and the quantum barrier layers may include differentcompositions of In_(x)Al_(y)Ga_(1-x-y)N (0≦x≦1, 0≦y≦1, 0≦x+y≦1),respectively. In a certain example, the quantum well layers may includea composition of In_(x)Ga_(1-x)N (0<x≦1), and the quantum barrier layersmay include GaN or AlGaN. The second conductive semiconductor layer 121c may be, for example, a nitride semiconductor layer satisfying acomposition of p-type In_(x)Al_(y)Ga_(1-x-y)N (0≦x<1, 0≦y<1, 0≦x+y<1),and a p-type impurity may be magnesium (Mg), zinc (Zn), or beryllium(Be).

Subsequently, the light emitting structure 121 may be etched to expose aregion of the first conductive semiconductor layer 121 a, forming amesa-etched region 122 in the light emitting structure 121.

The etching process may be performed as a process of removing regions ofthe second conductive semiconductor layer 121 c and the active layer 121b. An electrode may be formed in the region of the first conductivesemiconductor layer 121 a exposed by the mesa-etched region 122.

As illustrated in FIGS. 14A and 14B, an isolation process of dividingthe light emitting structure 121 into a plurality of light emittingregions may be performed.

Referring to FIG. 14A, an isolation region 123 a may be formed throughthe removal of a portion of the light emitting structure 121 to expose asurface of the substrate for growth 110 a. Such a process may allow thelight emitting structure 121 to be divided into a plurality of lightemitting regions, and may be supported by the substrate for growth 110a.

Referring to FIG. 14B, the isolation region 123 a may be formed in everythree light emitting regions. A sub-isolation region 123 b may be formedin a space between three light emitting regions. Such an isolationprocess may include a process of forming the isolation region 123 a byusing a blade, but the present inventive concept is not limited thereto.The sub-isolation region 123 b may be formed using a separate processdifferent from a process of forming the isolation region 123 a, but alsomay be formed using the same process as the process of forming theisolation region 123 a. The sub-isolation region 123 b may be narrowerthan the isolation region 123 a.

Subsequently, referring to FIGS. 15A and 15B, an insulating layer 124may be deposited to cover the light emitting structure 121 and thesurface of the substrate for growth 110 a.

Subsequently, referring to FIGS. 16A and 16B, a first photoresist layerPR1 may be applied to cover the insulating layer 124, an opening h1 maybe formed to expose a region of both the isolation region 123 a and thesub-isolation region 123 b, and a p-well region 131 may be formed byinjecting a p-type impurity into both the isolation region 123 a and thesub-isolation region 123 b. Prior to the formation of the p-well region131, an n-type pocket 132 may also be formed on the circumference of aregion in which the p-well region 131 may be formed by injecting ann-type impurity. After the p-well region 131 is formed, the firstphotoresist layer PR1 may be removed.

Subsequently, referring to FIGS. 17A and 17B, a second photoresist layerPR2 may be applied to cover the insulating layer 124, and openings h2and h3 may be formed to form n-well regions 133 a and 133 b within thep-well region 131. After the n-well regions 133 a and 133 b are formed,the second photoresist layer PR2 may be removed. According to an exampleembodiment, the insulating layer 124 may also be removed and thenredeposited.

Referring to FIGS. 18A and 18B, openings 125, 126, 127 a, and 127 b maybe formed by removing regions of the insulating layer 124. Further, asillustrated in FIGS. 19A and 19B, a first electrode 128, a secondelectrode 129, a drain electrode 134, and a source electrode 136 may beformed by depositing a conductive material in the openings 125, 126, 127a, and 127 b. Each of the first and second electrodes 128 and 129 may bea reflective electrode including at least one of silver (Ag), aluminum(Al), nickel (Ni), chromium (Cr), copper (Cu), gold (Au), palladium(Pd), platinum (Pt), tin (Sn), tungsten (W), rhodium (Rh), iridium (Ir),ruthenium (Ru), magnesium (Mg), and zinc (Zn), or alloys thereof. Aconnecting electrode 137 may be formed to electrically connect thesource electrode 136 to the second electrode 129. After the sourceelectrode 136 and the second electrode 129 are formed, the connectingelectrode 137 may be formed to connect the source electrode 136 to thesecond electrode 129, but the present inventive concept is not limitedthereto, and the source electrode 136, the second electrode 129, and theconnecting electrode 137 may also be formed integrally with each other.A gate electrode 135 may be formed on a gate insulating layer 124 a. Thegate electrode 135 may include, for example, at least one of dopedsilicon (Si), tungsten (W), TiN, or alloys thereof.

Subsequently, as illustrated in FIGS. 20A and 20B, first to thirdconductive vias 141 to 143 may be formed on the first electrode 128, thedrain electrode 134, and the gate electrode 135, respectively, and amolding unit 140 may be formed to cover the first to third semiconductorlight emitting units LED1 to LED3.

Thereafter, as illustrated in FIGS. 21A and 21B, a multilayer circuitboard 151 may be disposed to connect the first to third conductive vias141 to 143 to common electrode pads CP1 and CP2 and separate electrodepads AP1, AP2, and AP3. The multilayer circuit board 151 may include aplurality of PCBs 151 a and 151 b that may be stacked, and the PCBs 151a and 151 b may include a through electrode 154 and a wiring 156. Themultilayer circuit board 151 may have the common electrode pads CP1 andCP2 and the separate electrode pads AP1, AP2, and AP3 disposed on asurface thereof.

Subsequently, as illustrated in FIGS. 22A and 22B, first to third lightemitting windows 111 to 113 may be formed by etching regions of thesubstrate for growth 110 a, corresponding to the first to thirdsemiconductor light emitting units LED1 to LED3.

In the next step, as illustrated in FIGS. 23A and 23B, second and thirdwavelength conversion units 172 and 173 may be formed by dispensing alight-transmitting liquid resin, in which a wavelength conversionmaterial is mixed, such as a green or red phosphor P2 or P3, in thesecond and third light emitting windows 112 and 113, and a firstwavelength conversion unit 171 may be formed by dispensing alight-transmitting liquid resin, in which a phosphor is not mixed, inthe first light emitting window 111. According to an example embodiment,the first wavelength conversion unit 171 may include a blue orblue-green phosphor P1 (for example, wavelength: 480 nm to 520 nm) foradjusting color coordinates of blue light.

Subsequently, referring to FIGS. 24A and 24B, a light filtering layer180 may be disposed on the second and third wavelength conversion units172 and 173, and an encapsulation unit 190 may be formed on the first tothird wavelength conversion units 171 to 173 to prevent degradation ofthe phosphor.

At this point, as illustrated in FIGS. 25A and 25B, the light emittingdevice package 100, illustrated in FIGS. 5 and 6, may be manufactured bycutting the semiconductor light emitting device into separatesemiconductor light emitting device units, using a blade D.

FIG. 26 is a CIE 1931 color space chromaticity diagram illustrating awavelength conversion material employable in the first and secondwavelength conversion units 171 and 172 according to an exampleembodiment of the present inventive concept.

Referring to the CIE 1931 color space chromaticity diagram illustratedin FIG. 26, white light generated by combining yellow, green, and redphosphors with a blue light emitting device or by combining a greenlight emitting device and a red light emitting device with a blue lightemitting device, may have two or more peak wavelengths, and may bepositioned in an area of segments connecting (x, y) coordinates (0.4476,0.4074), (0.3484, 0.3516), (0.3101, 0.3162), (0.3128, 0.3292), (0.3333,0.3333) of the CIE 1931 color space chromaticity diagram. Alternatively,the white light may be located in an area surrounded by the segments anda blackbody radiation spectrum. A color temperature of the white lightmay range from 2,000K to 20,000K. As illustrated in FIG. 26, white lightadjacent to Point E (0.3333, 0.3333) below the blackbody radiationspectrum may be used as a light source for lighting, to create clearerviewing conditions for the naked eye while light having a yellow-basedcomponent is reduced. Thus, a lighting product using white lightadjacent to Point E (0.3333, 0.3333), below the blackbody radiationspectrum, may be useful as lighting for a retail space in which consumergoods are sold, for example.

Various materials, such as a phosphor or a quantum dot (QD), may be usedas a material for converting a wavelength of light emitted by the firstto third semiconductor light emitting units LED1 to LED3 employed in anexample embodiment.

The phosphor may have the following formulae and colors: yellow andgreen Y₃Al₅O₁₂:Ce, yellow and green Tb₃Al₅O₁₂:Ce, and yellow and greenLu₃Al₅O₁₂:Ce (oxide-based); yellow and green (Ba, Sr)₂SiO₄:Eu and yellowand orange (Ba, Sr)₃SiO₅:Ce (silicate-based); green β-SiAlON:Eu, yellowLa₃Si₆N₁₁:Ce, orange α-SiAlON:Eu, red CaAlSiN₃:Eu, red Sr₂Si₅N₈:Eu, redSrSiAl₄N₇:Eu, red SrLiAl₃N₄:Eu, and red Ln_(4-x)(Eu_(z)M_(1-z))_(x)Si_(12-y)Al_(y)O_(3+x+y)N_(18-x-y) (0.5≦x≦3, 0<z<0.3,0<y≦4) (nitride-based), in which Ln may be at least one kind of elementselected from the group consisting of group IIIa elements and rare earthelements, and M may be at least one kind of element selected from thegroup consisting of calcium (Ca), barium (Ba), strontium (Sr), andmagnesium (Mg); and KSF-based red K₂SiF₆:Mn₄ ⁺, KSF-based red K₂TiF₆:Mn₄⁺, KSF-based red NaYF₄:Mn₄ ⁺, KSF-based red NaGdF₄:Mn₄ ⁺, and KSF-basedred K₃SiF₇:Mn⁴⁺ (fluoride-based) (for example, a composition ratio of Mnmay satisfy 0<z≦0.17).

A phosphor composition may be required to conform with stoichiometry,and respective elements thereof may be replaced with other elements ineach group in which a corresponding element is included from theperiodic table. For example, strontium (Sr) may be substituted withbarium (Ba), calcium (Ca), magnesium (Mg), or the like, of alkalineearth metals (group II), and yttrium (Y) may be substituted with terbium(Tb), lutetium (Lu), scandium (Sc), gadolinium (Gd), or the like, oflanthanides. In addition, europium (Eu), an activator, or the like, maybe substituted with cerium (Ce), terbium (Tb), praseodymium (Pr), erbium(Er), ytterbium (Yb), or the like, according to desired energy levels.An activator may be applied singly, or an additional sub-activator, orthe like, may also be applied to modify characteristics.

In particular, the fluoride-based red phosphors may be coated with afluoride not containing Mn, or may further include an organic coating ona surface coated with a fluoride not containing Mn, in order to improvereliability at high temperatures and high humidity. In the case of thefluoride-based red phosphor described above, since a narrow full widthat half maximum (FWHM) less than or equal to 40 nm may be implemented,unlike with other phosphors, the fluoride-based red phosphor may be usedfor a high-resolution television, such as an ultra high definition (UHD)TV.

Table 1 below indicates types of phosphors by application fields of alight emitting device package using a blue LED chip (dominantwavelength: 440 nm to 460 nm) or an ultraviolet (UV) LED chip (dominantwavelength: 380 nm to 430 nm).

TABLE 1 Use Phosphor LED TV BLU β-SiAlON:Eu²⁺, (Ca, Sr)AlSiN₃:Eu²⁺,La₃Si₆N₁₁:Ce³⁺, K₂SiF₆:Mn⁴⁺, SrLiAl₃N₄:Eu,Ln_(4−x)(Eu_(z)M_(1−z))_(x)Si_(12−y)Al_(y)O_(3+x+y)N_(18−x−y) (0.5 ≦ x ≦3, 0 < z < 0.3, 0 < y ≦ 4), K₂TiF₆:Mn⁴⁺, NaYF₄:Mn⁴⁺, NaGdF₄:Mn⁴⁺,K₃SiF₇:Mn⁴⁺ Lighting Lu₃Al₅O₁₂:Ce³⁺, Ca-α-SiAlON:Eu²⁺, DeviceLa₃Si₆N₁₁:Ce³⁺, (Ca, Sr)AlSiN₃:Eu²⁺, Y₃Al₅O₁₂:Ce³⁺, K₂SiF₆:Mn⁴⁺,SrLiAl₃N₄:Eu,Ln_(4−x)(Eu_(z)M_(1−z))_(x)Si_(12−y)Al_(y)O_(3+x+y)N_(18−x−y) (0.5 ≦ x ≦3, 0 < z < 0.3, 0 < y ≦ 4), K₂TiF₆:Mn⁴⁺, NaYF₄:Mn⁴⁺, NaGdF₄:Mn⁴⁺,K₃SiF₇:Mn⁴⁺ Side Viewing Lu₃Al₅O₁₂:Ce³⁺, Ca-α-SiAlON:Eu²⁺, ScreenLa₃Si₆N₁₁:Ce³⁺, (Ca, Sr)AlSiN₃:Eu²⁺, (Mobile Y₃Al₅O₁₂:Ce³⁺, (Sr, Ba, Ca,Mg)₂SiO₄:Eu²⁺, Device, Laptop K₂SiF₆:Mn⁴⁺, SrLiAl₃N₄:Eu, PC, etc.)Ln_(4−x)(Eu_(z)M_(1−z))_(x)Si_(12−y)Al_(y)O_(3+x+y)N_(18−x−y) (0.5 ≦ x ≦3, 0 < z < 0.3, 0 < y ≦ 4), K₂TiF₆:Mn⁴⁺, NaYF₄:Mn⁴⁺, NaGdF₄:Mn⁴⁺,K₃SiF₇:Mn⁴⁺ Electronic Lu₃Al₅O₁₂:Ce³⁺, Ca-α-SiAlON:Eu²⁺, LightingLa₃Si₆N₁₁:Ce³⁺, (Ca, Sr)AlSiN₃:Eu²⁺, Device Y₃Al₅O₁₂:Ce³⁺, K₂SiF₆:Mn⁴⁺,SrLiAl₃N₄:Eu, (Headlamp,Ln_(4−x)(Eu_(z)M_(1−z))_(x)Si_(12−y)Al_(y)O_(3+x+y)N_(18−x−y) (0.5 ≦ x ≦3, etc.) 0 < z < 0.3, 0 < y ≦ 4), K₂TiF₆:Mn⁴⁺, NaYF₄:Mn⁴⁺, NaGdF₄:Mn⁴⁺,K₃SiF₇:Mn⁴⁺

In addition, QD's may be used as wavelength conversion materials. Here,the QD's may replace phosphors, or may be mixed with phosphors.

FIG. 27 is a view of an indoor smart network system in which a displaypanel according to an example embodiment of the present inventiveconcept may be employed.

A network system 1000 according to an example embodiment may be acomplex smart network system in which lighting technology, Internet ofThings (IoT) technology, wireless communications technology, and thelike, using a semiconductor light emitting device, such as an LED,converge. The network system 1000 may be implemented using a displaypanel according to an example embodiment described above, lightingdevices and wired/wireless communications devices, or may be realized byusing a sensor, a controller, a communications unit, software fornetwork control and maintenance, or the like.

The network system 1000 may be applied to an open space, such as a parkor a street, as well as to a closed space defined within a building,such as a home or an office. The network system 1000 may be implementedon the basis of an IoT environment to collect or process various piecesof information and provide the collected or processed information to auser. The LED lamp 1200 may function to check and control operationalstates of other devices 1300 to 1800 included in the IoT environment, onthe basis of a function of the LED lamp 1200, such as visible lightcommunications, as well as to receive information regarding surroundingsfrom a gateway 1100 to control lighting of the LED lamp 1200 itself.

Referring to FIG. 27, the network system 1000 may include the gateway1100 processing data transmitted and received over differentcommunications protocols, the LED lamp 1200 connected to the gateway1100 to communicate therewith and including an LED as a light source,and the devices 1300 to 1800 connected to the gateway 1100 tocommunicate therewith according to various wireless communicationsschemes. To realize the network system 1000 on the basis of the IoTenvironment, each of the devices 1300 to 1800, as well as the LED lamp1200, may include at least one communications module. As an example, theLED lamp 1200 may be connected to the gateway 1100 to communicatetherewith using a wireless communications protocol, such aswireless-fidelity (Wi-Fi), Zigbee®, or light-fidelity (Li-Fi), and tothis end, the LED lamp 1200 may have at least one lamp communicationsmodule 1210.

As described above, the network system 1000 may be applied to an openspace, such as a park or a street, as well as to a closed space, such asa home or an office. When the network system 1000 is applied to a home,the plurality of devices 1300 to 1800 included in the network system1000 and connected to the gateway 1100 to communicate therewith on thebasis of IoT technology may include home appliances 1300, a digital doorlock 1400, a garage door lock 1500, a lighting switch 1600 installed ona wall or the like, a router 1700 for wireless network relay, and amobile device 1800 such as a smartphone, a tablet PC, or a laptop PC.

In the network system 1000, the LED lamp 1200 may check operating statesof the various devices 1300 to 1800, or may automatically controlluminance of the LED lamp 1200 itself, according to surroundings orcircumstances, using a wireless communications network (Zigbee™, Wi-Fi,Li-Fi, or the like) installed in a home. Further, use of Li-Ficommunications using visible light emitted by the LED lamp 1200 mayallow the devices 1300 to 1800 included in the network system 1000 to becontrolled.

First, the LED lamp 1200 may automatically control the luminance of theLED lamp 1200 on the basis of information regarding surroundingstransmitted from the gateway 1100 through the lamp communications module1210, or information regarding circumstances collected by a sensormounted in the LED lamp 1200. For example, brightness of the LED lamp1200 may be automatically controlled according to a type of a programbeing broadcast on the television 1310 or brightness of an image. Tothis end, the LED lamp 1200 may receive operational information from thetelevision 1310 by the lamp communications module 1210 connected to thegateway 1100. The lamp communications module 1210 may be integrallymodularized with a sensor or a controller included in the LED lamp 1200.

For example, in a case in which a program broadcast on the television1310 is a drama, a color temperature of illumination may be controlledto be less than or equal to 12,000K, such as 6,000K, according topredetermined settings to control colors, thereby creating a cozyatmosphere. In a different manner, when a program is a comedy, thenetwork system 1000 may be configured in such a manner that a colortemperature of illumination may be increased to 6,000K or more, and tobe blue-based white lighting, according to predetermined settings.

When a certain period of time has elapsed after the digital door lock1400 is locked while there is no person in a home, the network system1000 may allow all LED lamps 1200 turned on to be turned off, therebypreventing wastage of electricity. Alternatively, in a case in which asecurity mode is set by the mobile device 1800, or the like, when thedigital door lock 1400 is locked without a person in a home, the LEDlamp 1200 may remain turned on.

Operations of the LED lamp 1200 may also be controlled according toinformation regarding circumstances collected by various types ofsensors connected to the network system 1000. For example, when thenetwork system 1000 is implemented within a building, a light, aposition sensor, and a communications module may be combined with eachother in the building to collect information on locations of people inthe building so that the light may be turned on or off, or the collectedinformation may be provided to a user in real time, thereby enablingfacility management or efficient use of an idle space. In general, sincea lighting device, such as the LED lamp 1200, may be disposed in almostall of the spaces on each floor of a building, various pieces ofinformation within the building may be collected by a sensor integratedwith the LED lamp 1200, and the collected information may be used again,for the management of facilities, the utilization of idle space, or thelike.

Meanwhile, a combination of the LED lamp 1200 with an image sensor, astorage device, the lamp communications module 1210, and the like, mayallow the LED lamp 1200 to be utilized as a device that may maintainbuilding security or detect and deal with an emergency. For example,when a smoke or temperature sensor, or the like, is attached to the LEDlamp 1200, a fire, or the like, may be promptly detected tosignificantly reduce damage. In addition, brightness of lighting may becontrolled in consideration of external weather or an amount ofsunshine, thus saving energy and providing a comfortable lightingenvironment.

As set forth above, according to example embodiments of the presentinventive concept, a light emitting device package not requiring aseparate thin film transistor (TFT) substrate, by disposing a switchingunit for controlling a semiconductor light emitting device within apartition structure of a wavelength conversion unit, a method ofmanufacturing the light emitting device package, and a display apparatususing the light emitting device package, are provided.

While exemplary embodiments have been shown and described above, it willbe apparent to those skilled in the art that modifications andvariations could be made without departing from the scope of the presentdisclosure.

What is claimed is:
 1. A light emitting device package comprising: acell array, including a plurality of semiconductor light emitting units,and having a first surface and a second surface opposite the firstsurface, each of the plurality of semiconductor light emitting unitsincluding a first conductive semiconductor layer, an active layer, and asecond conductive semiconductor layer stacked on each other; a pluralityof wavelength conversion units disposed on the first surface of the cellarray to correspond to the plurality of semiconductor light emittingunits, respectively, each configured to convert a wavelength of light,emitted by a respective one of the plurality of semiconductor lightemitting units, into a different wavelength of light; a partitionstructure disposed in a space between the plurality of wavelengthconversion units so as to separate the plurality of wavelengthconversion units from each other; and a plurality of switching unitsspaced apart from the plurality of wavelength conversion units withinthe partition structure, and electrically connected to the plurality ofsemiconductor light emitting units so as to selectively drive theplurality of semiconductor light emitting units.
 2. The light emittingdevice package of claim 1, wherein each of the plurality of switchingunits includes a field effect transistor (FET), and the FET is formed bydoping a region of the partition structure, and includes: a sourceregion and a drain region spaced apart from each other; a sourceelectrode and a drain electrode electrically connected to the sourceregion and the drain region, respectively; a gate insulating layerdisposed on the source region and the drain region; and a gate electrodedisposed on the gate insulating layer.
 3. The light emitting devicepackage of claim 2, wherein the FET is an N-channel metal-oxidesemiconductor field effect transistor (MOSFET).
 4. The light emittingdevice package of claim 2, wherein each of the plurality ofsemiconductor light emitting units further includes a first electrode,and a second electrode connected to the first conductive semiconductorlayer and the second conductive semiconductor layer, respectively, andthe second electrode extends to the source electrode of each of theplurality of switching units to connect to the source electrode orextends to the drain electrode of each of the plurality of switchingunits to connect to the drain electrode.
 5. The light emitting devicepackage of claim 4, wherein the second electrode and the sourceelectrode include materials having different compositions.
 6. The lightemitting device package of claim 2, wherein the cell array furtherincludes a molding unit covering the plurality of semiconductor lightemitting units.
 7. The light emitting device package of claim 6, furthercomprising a space between the molding unit and the plurality ofsemiconductor light emitting units, and an insulating layer disposed inthe space.
 8. The light emitting device package of claim 7, wherein theinsulating layer includes a material having the same composition as acomposition included in the gate insulating layer.
 9. The light emittingdevice package of claim 1, wherein each of the plurality of switchingunits has a region contacting the first surface of the cell array. 10.The light emitting device package of claim 1, wherein the plurality ofsemiconductor light emitting units are arranged in a row that isparallel with respect to the first surface.
 11. The light emittingdevice package of claim 1, wherein the partition structure is asubstrate for growth including silicon (Si).
 12. The light emittingdevice package of claim 1, wherein the active layer of each of theplurality of semiconductor light emitting units emits ultraviolet light,and each of the plurality of wavelength conversion units converts awavelength of ultraviolet light into a wavelength of one of red, green,or blue light.
 13. The light emitting device package of claim 1, whereinthe active layer of each of the plurality of semiconductor lightemitting units emits white light, and each of the plurality ofwavelength conversion units converts a wavelength of white light into awavelength of one of red, green, or blue light.
 14. The light emittingdevice package of claim 1, wherein the active layer of each of theplurality of semiconductor light emitting units emits blue light, andeach of the plurality of wavelength conversion units converts awavelength of blue light into a wavelength of one of red or green light.15. A light emitting device package comprising: a substrate for growthhaving a first plane and a second plane opposing the first plane; aplurality of semiconductor light emitting units disposed on the firstplane of the substrate for growth to be spaced apart from each other,and each having a first conductive semiconductor layer, an active layer,and a second conductive semiconductor layer; a plurality of wavelengthconversion units contacting the plurality of semiconductor lightemitting units, respectively, and spaced apart from each other to have aportion of the substrate for growth therebetween, each configured toconvert a wavelength of light, emitted by a respective one of theplurality of semiconductor light emitting units, into a differentwavelength of light; and a plurality of switching units disposed in thesubstrate for growth and on the first plane of the substrate for growthto be spaced apart from the plurality of semiconductor light emittingunits, and electrically connected to the plurality of semiconductorlight emitting units so as to selectively drive the plurality ofsemiconductor light emitting units.
 16. The light emitting devicepackage of claim 15, wherein the plurality of wavelength conversionunits fill through holes connecting the first plane of the substrate forgrowth to the second plane thereof.
 17. The light emitting devicepackage of claim 15, wherein each of the plurality of switching unitsincludes an FET, the FET is formed by doping a region of the substratefor growth, and includes: a source region and a drain region spacedapart from each other; a source electrode and a drain electrodeelectrically connected to the source region and the drain region,respectively; a gate insulating layer disposed on the source region andthe drain region; and a gate electrode disposed on the gate insulatinglayer, and each of the plurality of semiconductor light emitting unitsfurther includes a first electrode and a second electrode connected tothe first conductive semiconductor layer and the second conductivesemiconductor layer, respectively.
 18. The light emitting device packageof claim 17, further comprising a molding unit covering the plurality ofsemiconductor light emitting units and the plurality of switching units,wherein the molding unit allows a first through electrode, a secondthrough electrode, and a third through electrode, connected to the drainelectrode, the gate electrode, and the first electrode, to be disposedin a thickness direction of the molding unit.
 19. The light emittingdevice package of claim 17, wherein the gate insulating layer isdisposed on a surface of the substrate for growth.
 20. A light emittingdevice package comprising: a cell array, including a plurality ofsemiconductor light emitting units, each semiconductor light emittingunit having a first surface at a first vertical height and a secondsurface opposite the first surface at a second vertical height, and eachsemiconductor light emitting unit including a first conductivesemiconductor layer, an active layer, and a second conductivesemiconductor layer stacked on each other; a plurality of wavelengthconversion units disposed respectively on the plurality of semiconductorlight emitting units, each wavelength conversion unit having a firstsurface at the first vertical height and a second surface at a thirdvertical height, wherein the first vertical height is between the secondvertical height and the third vertical height, each wavelengthconversion unit configured to convert a wavelength of light, emitted bya respective one of the plurality of semiconductor light emitting units,into a different wavelength of light; a partition structure disposed ina space between the plurality of wavelength conversion units so as toseparate the plurality of wavelength conversion units from each other,the partition structure extending between the first vertical height andthe third vertical height; and a plurality of switching units spacedapart from the plurality of wavelength conversion units within thepartition structure, and electrically connected to the plurality ofsemiconductor light emitting units so as to selectively drive theplurality of semiconductor light emitting units, each switching unitdisposed between the first vertical height and the third verticalheight.